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10th-11th April 2018, Brussels, Belgium

3 Conferences, 2 Days, 1 Exhibition

Over 550 delegates and 55 exhibitors

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Speakers Include

Ferrotec
Speaker TBC
Transphorm
Philip Zuk
Quora Technology
Speaker TBC
Plessey
Keith Strickland
Panasonic
Hiroyuki Handa
Revasum
Speaker TBC
Ostendo
J.C.Chen
Yole
Zhen Zong
Qorvo
Roger Hall
Nanotronics
Speaker TBC
Plextek RFI
Liam Devlin
IMS Chips
Mohammed Alomari
NAsP III-V
Wolfgang Stolz
CS Catapult
Speaker TBC
Evatec
Speaker TBC
IHS Markit
Richard Eden
Strategy Analytics
Asif Anwar
AIXTRON
Speaker TBC
EPC
Nick Cataldo
EpiGaN
Speaker TBC
KU Leuven
Jean-Pierre Locquet
Infineon
Peter Friedrichs
Lund University
Lars-Erik Wernersson
VisIC
Tamara Baksht
Seoul
Andreas Weisl

SPEAKERS INCLUDE

Speaker TBC, Ferrotec
Philip Zuk, Transphorm
Speaker TBC, Quora Technology
Keith Strickland, Plessey
Hiroyuki Handa, Panasonic
Speaker TBC, Revasum
J.C.Chen, Ostendo
Zhen Zong, Yole

Roger Hall, Qorvo
Speaker TBC, Nanotronics
Liam Devlin, Plextek RFI
Mohammed Alomari, IMS Chips
Wolfgang Stolz, NAsP III-V
Speaker TBC, CS Catapult
Speaker TBC, Evatec
Richard Eden, IHS Markit

Asif Anwar, Strategy Analytics
Speaker TBC, AIXTRON
Nick Cataldo, EPC
Speaker TBC, EpiGaN
Jean-Pierre Locquet, KU Leuven
Peter Friedrichs, Infineon
Lars-Erik Wernersson, Lund University
Tamara Baksht, VisIC

Andreas Weisl, Seoul

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Sponsorship Opportunities

Increased brand awareness

Maintain and grow customer relationships

Gain visibility and recognition as a market leader

Connecting, informing and inspiring the compound semiconductor industry

10th-11th April 2018, Brussels, Belgium

five KEY INDUSTRY THEMES

The presentations were grouped into five key themes for the 2017 conference which collectively provided complete coverage of the compound semiconductor industry.

Each industry key theme had a keynote presentation from a leading industry figure, as well as an analyst presentation tailored to the theme.


Speakers Include

Nick Cataldo
Richard Eden
Mohammed Alomari
Peter Friedrichs
Jean-Pierre Locquet
Lars-Erik Wernersson
Wolfgang Stolz
J.C.Chen
Hiroyuki Handa
Keith Strickland
Liam Devlin
Roger Hall
Andreas Weisl
Eric Higham
Philip Zuk
Tamara Baksht
Zhen Zong

A selection of quotes

3 Conferences, 2 Days, 1 Exhibition

Compound Semiconductor International

The 8th CS International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning five sectors.

Together, these talks will detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs.

Attendees at this two-day conference will gain an up-to-date overview of the status of the CS industry, and have opportunities to meet many other key players within this community.

Photonic Integrated Circuits International

Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by organising the 3rd PIC International Conference, a global conference dedicated to this industry.

Attendees to the conference will hear industry-leading insiders delivering more than 30 presentations spanning five sectors. The conference will equip the delegates with an up-to-date overview of the status of the PIC industry, and provided them with many opportunities to meet other key players within this community.

High End Sensors International

High-end sensor devices are an increasingly significant share of the global machine sensory market that is expected to exceed 30 billion devices by 2020 with revenue of (USD) $20 billion. We will explore opportunities for the most advanced sensors that deliver higher performance, ruggedness and longer operational lifetimes. We will examine new technologies that are cutting costs while increasing effectiveness. We will explore product development within major high-end sensor categories and ways that researchers and manufacturers are investigating to enhance performance, reduce power consumption, and improve efficiency.

3/2/1

THREE cutting edge complimentary conferences and ONE dedicated exhibition featuring leading players from across the globe.

Access to 3

Registration at one conference allows access to all other conference sessions


Platinum Sponsors


Gold Sponsors


Wi-Fi


Portfolio


Delegate Bag


Supported By

Book your place today - 3 events, 2 days, 1 ticket
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