Dr. Bernd Dielacher is business development manager at EV Group (EVG) where he evaluates global market trends and develops growth opportunities for EVG's bonding, lithography and nanoimprint businesses with a particular focus on the MEMS, biomedical technology and power device market.
Bernd holds a master’s degree in Microelectronics from Vienna University of Technology and received a PhD in Biomedical Engineering from ETH Zurich.
The presentation highlights the cutting edge developments in heterogeneous integration of compound semiconductors with a focus on the innovative technologies of W2W and D2W bonding. The advanced processes demonstrated in the presentation foster state of the art micro LED display development and many other technologies. The key methodologies, challenges and applications associated with these advanced bonding techniques are demonstrated.